Manual Assembly Processes vs. Automated Assembly Processes (Pick and Place)

Printed circuit board (PCB) assembly can be performed either manually or through automated machinery. The choice of assembly process depends on factors such as component type, production volume, and manufacturing capabilities. Some manufacturers handle both PCB fabrication and assembly in-house, while others specialize in either fabrication or assembly. The method of assembly significantly impacts PCB layout, component clearance, and soldering techniques. This article explores the differences between manual and automated assembly processes, highlighting their advantages and limitations.

Manual Assembly Processes

Manual assembly is commonly used for prototyping, low-volume production, and assembling components that cannot be easily placed by automated machinery. Both surface-mount technology (SMT) and through-hole technology (THT) components can be manually assembled. In small-scale operations, assembly lines may consist of multiple workers, each responsible for placing specific components. Throughout the process, functional testing of PCB sections is often performed to ensure quality control.

manual pcb soldering

Manual assembly involves either fully manual soldering or a combination of manual placement with automated soldering methods. Ensuring consistent component orientation helps improve assembly efficiency. For instance, aligning polarized components like capacitors and diodes in the same direction and orienting integrated circuits (ICs) consistently with pin 1 facing the same way reduces assembly errors and increases yield.

However, manual assembly can be time-consuming and labor-intensive, making it less suitable for high-volume production. Additionally, human errors in placement and soldering can lead to defects, requiring additional inspection and rework.

Automated Assembly Processes (Pick and Place)

Automated assembly utilizes pick-and-place machines to position components on a PCB rapidly and accurately. These machines extract components from reels or bins and place them on the board with precise orientation and alignment. Pick-and-place technology is used for both through-hole components (radial- and axial-leaded) and surface-mounted devices (SMDs).

Through-Hole Automated Assembly

Through-hole components are typically packaged in reels or strips, which are automatically fed into pick-and-place machines. These machines can populate PCBs at rates of 20,000 to 40,000 components per hour (CPH), significantly increasing efficiency. Through-hole components are usually placed on the top side of the board to facilitate wave soldering, ensuring secure connections.

Overview of the Wave Soldering Machine

The standard automated through-hole assembly sequence includes:

  • Insertion of dual inline packages (DIPs)
  • Placement of axial-leaded components
  • Placement of radial-leaded components
  • Placement of odd-form components

After component insertion, the board undergoes wave soldering or intrusive reflow soldering to secure the connections. Learn more about the reflow soldering process and its role in PCB manufacturing.

Surface-Mount Automated Assembly

SMDs are often packaged in tubes, matrix trays, tapes, or bulk containers. They may be mounted on one or both sides of a PCB. The automated assembly process typically follows these steps:

  1. Solder Paste Application: Solder paste is screen-printed onto the PCB’s solder pads.
  2. Component Placement: Pick-and-place machines position components onto the board with high precision.
  3. Reflow Soldering: The PCB passes through a reflow oven, where the solder melts and then cools, securing the components.

Automated systems can place SMDs at speeds ranging from 10,000 to 100,000 CPH, making them ideal for high-volume production.

For double-sided SMD assemblies, a two-step reflow soldering process is employed:

  • The top-side components are placed first using a high-temperature solder paste and reflowed.
  • The board is flipped, and bottom-side components are attached using a lower-temperature solder paste before undergoing a second reflow process.

When a PCB contains both SMDs and through-hole components, a sequential reflow/wave soldering process is used. First, the top-mounted SMDs are reflow soldered. Next, through-hole components are inserted and secured using adhesives or clinched leads. Bottom-mounted SMDs are then positioned and held in place by glue before undergoing a final wave-soldering process.

Choosing Between Manual and Automated Assembly

Factor Manual Assembly Automated Assembly
Production Volume Suitable for low-volume and prototyping Ideal for medium to high-volume production
Placement Accuracy Dependent on assembler skill High precision with minimal errors
Component Types Works well for large, odd-shaped components Best for standard SMDs and THT components
Speed Slow and labor-intensive Very fast (up to 100,000 CPH for SMDs)
Cost Efficiency High labor costs, but low setup costs Expensive initial setup, but lower per-unit cost
Error Rate Higher risk of misplacement and defects Low error rate due to machine precision

Automated assembly is preferred for mass production, ensuring higher efficiency, accuracy, and consistency. However, manual assembly remains relevant for prototyping, small batches, and special component placement.

Optimizing PCB Assembly for Cost and Performance

Regardless of the chosen assembly method, proper PCB design plays a crucial role in efficiency and cost-effectiveness. Consider the following:

Conclusion

Both manual and automated assembly processes have their advantages and applications. Manual assembly is well-suited for prototyping and custom work, while automated pick-and-place processes dominate high-volume manufacturing due to their speed and precision. By optimizing PCB design and selecting the appropriate assembly method, manufacturers can achieve the best balance of cost, performance, and reliability in electronic production.

For more insights into PCB assembly techniques, visit EE Diary and explore expert guides on electronics manufacturing and design.

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